公开(公告)号：US20220284153A1

公开(公告)日：2022-09-08

申请号：US17632481

申请日：2019-08-28

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  Siemens Industry Software Inc.

Inventor： Stefan Gavranovic ,  Suraj Ravi Musuvathy ,  Dirk Hartmann ,  Peter Nanson ,  Richard Collins ,  Hiren Dedhia

IPC: G06F30/20 ,  G06F30/10

Abstract: A computing system may include a geometry access engine configured to access geometries associated with a topology optimization process, including an original geometry that represents a design space upon which the topology optimization process applies to as well as a topology optimized geometry that represents an output of the topology optimization process performed for the original geometry. The system may also include geometry processing engine configured to generate a final geometry from the topology optimized geometry, including by conforming the topology optimized geometry to the original geometry at portions of the topology optimized geometry that correspond to fixed regions of the original geometry as well as smoothing the topology optimized geometry at portions that correspond to non-fixed regions of the original geometry.

公开(公告)号：US20220253576A1

公开(公告)日：2022-08-11

申请号：US17629967

申请日：2019-08-27

Applicant: Siemens Industry Software Inc.

Inventor： Suraj Ravi Musuvathy ,  David Madeley ,  Lucia Mirabella ,  Stefan Gavranovic ,  Dirk Hartmann

IPC: G06F30/23 ,  G06F30/17 ,  B29C64/393 ,  B33Y50/02

Abstract: A computing system may include a design access engine and a design processing engine. The design access engine may be configured to access an object design to be constructed through additive manufacturing. The design processing engine may be configured to represent the object design as a combination of coarse geometric elements and high-resolution lattice elements and process the object design based on both the coarse geometric elements and the high-resolution lattice elements. Processing of the object design may include generation of lattice infills, lattice simulations, or a combination of both.