公开(公告)号：US20240288319A1

公开(公告)日：2024-08-29

申请号：US18681795

申请日：2021-08-31

申请人： Siemens Industry Software Inc.

发明人： Gabor Farkas ,  Zoltan Sarkany

IPC分类号： G01K7/01 ,  H03K17/687

CPC分类号： G01K7/01 ,  H03K17/687

摘要： A method of measuring the junction temperature, Tj, of a semiconductor switching element in real-time, and a device for carrying out such a measurement are described. A plurality of measurements of a first and a second, different, temperature-sensitive parameter (TSP) of the semiconductor switching element while recording other quantities determining the semiconductor switching element operating point is taken. The junction temperature value based on the measured values of the first temperature-sensitive parameter and the at least one second temperature-sensitive parameter are calculated and compared to determine the actual junction temperature Tj. Each of the plurality of measurements of the first temperature-sensitive parameter and the at least one second temperature-sensitive parameter is synchronized with a switching event of the semiconductor switching element.