公开(公告)号：US09346196B2

公开(公告)日：2016-05-24

申请号：US13481857

申请日：2012-05-27

申请人： Si-Chen Lee ,  Chieh-Hung Yang ,  Chun-Yuan Hsueh

发明人： Si-Chen Lee ,  Chieh-Hung Yang ,  Chun-Yuan Hsueh

IPC分类号： B29C41/00 ,  B29C41/36 ,  B29C33/42 ,  B29C41/38

CPC分类号： B29C41/36 ,  B29C33/424 ,  B29C41/38 ,  Y10T428/24479

摘要： Disclosed herein are a flexible substrate with surface structure and a method for manufacturing the flexible substrate. The disclosure relates to a low-cost process to manufacturing the flexible substrate that is adapted to the large-area mass production. According to one of the embodiments in the disclosure, the method introduces a mold with surface structure. An isolation material is formed on the mold surface in an earlier stage. Upon the isolation layer, a flexible substrate material is coated. After that, a baking step is employed to cure the flexible substrate material. The flexible substrate with surface structure is therefore formed after de-molding the cured substrate. Another aspect to the disclosure adopts the above-formed substrate to be a base substrate. A second flexible substrate with the surface structure identical to the mold is then formed by performing the above steps.

摘要翻译： 本文公开了具有表面结构的柔性基板和用于制造柔性基板的方法。 本公开涉及适于大面积批量生产的制造柔性基板的低成本方法。 根据本公开的一个实施例，该方法引入具有表面结构的模具。 在早期阶段，在模具表面上形成隔离材料。 在隔离层上涂覆柔性基材。 之后，使用烘烤步骤来固化柔性基材。 因此，具有表面结构的柔性基板在脱模固化的基板之后形成。 本公开的另一方面采用上述形成的基底作为基底。 然后通过执行上述步骤形成具有与模具相同的表面结构的第二柔性基板。