公开(公告)号：US20220204826A1

公开(公告)日：2022-06-30

申请号：US17605661

申请日：2019-11-21

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Shujie QU ,  Souichirou KOMIYA ,  Takuya IMAI ,  Kazuyuki MAGOME ,  Junichi KAMEI

IPC: C09J175/06 ,  C08G18/42 ,  C08G18/12 ,  C09J7/35

Abstract: A moisture-curable hot-melt adhesive composition is disclosed. This moisture-curable hot-melt adhesive composition contains: a urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having two or more isocyanate groups; and a modified urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having one or more isocyanate groups modified with a castor oil monool.