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公开(公告)号:US20240357882A1
公开(公告)日:2024-10-24
申请号:US18289315
申请日:2021-06-24
发明人: Yukio SHIMIZU , Shinzoh MURAKAMI
IPC分类号: H10K59/131 , H10K59/80 , H10K77/10 , H10K102/00
CPC分类号: H10K59/131 , H10K59/8731 , H10K77/111 , H10K2102/311
摘要: In a chip mounting portion, a plurality of chip terminals arranged in a row and a plurality of terminal wiring lines corresponding to the plurality of chip terminals, the plurality of terminal wiring lines extending parallel to one another and being electrically connected to the plurality of chip terminals, respectively, are provided. For at least one chip terminal of the plurality of chip terminals, a chip support body is provided at each terminal wiring line with the chip support body overlapping the terminal wiring line corresponding to the at least one chip terminal or an extension line of the terminal wiring line.