Hybrid shape memory effect elements for facile integration to structures

    公开(公告)号:US10543533B2

    公开(公告)日:2020-01-28

    申请号:US14595079

    申请日:2015-01-12

    IPC分类号: B22F7/08 B22F3/02 B32B15/01

    摘要: There is disclosed a method for chemically bonding TiNi materials to Nitinol constructs, comprising placing a Nitinol construct within a mold and packing a powder combination comprising Ti powder and Ni powder, and powder comprised of zero or more of the elements Cu, Hf, Zr, Pt, Pd, Au, Cd, Ag, Nb, Ta, O, N, B, and H, into the mold. The method further includes initiating a process of self-propagating high temperature synthesis of the powder combination within the mold to create a chemical bond between the Nitinol construct and a resulting TiNi foam to thereby create a Nitinol and TiNi assembly.