公开(公告)号：US20100136884A1

公开(公告)日：2010-06-03

申请号：US12624967

申请日：2009-11-24

申请人： Sehoon OH ,  Seong-soo KIM

发明人： Sehoon OH ,  Seong-soo KIM

IPC分类号： B24B51/00 ,  B24B7/20

CPC分类号： B24B37/042 ,  B24B41/047 ,  B24B49/16

摘要： Provided are a substrate polishing apparatus and a method of polishing a substrate using the same. The substrate polishing apparatus includes a substrate supporting member, a polishing unit, and a control unit. The substrate is seated on the rotatable substrate supporting member. The polishing unit includes a rotatable and swingable polishing pad to polish a top surface of the substrate. The control unit controls the substrate supporting member and the polishing unit during a polishing process to adjust a value of a polishing variable adjusting a polishing amount of the substrate according to a horizontal position of the polishing pad with respect to the substrate. Therefore, the substrate polishing apparatus may locally adjust the polishing amount of the substrate to improve polishing uniformity and product yield.

摘要翻译： 本发明提供一种基板研磨装置及使用该基板研磨装置的基板的研磨方法。 基板抛光装置包括基板支撑部件，抛光单元和控制单元。 基板被安置在可旋转的基板支撑构件上。 抛光单元包括可旋转和可摆动的抛光垫，以抛光衬底的顶表面。 控制单元在抛光处理期间控制基板支撑构件和抛光单元，以根据抛光垫相对于基板的水平位置来调整调整基板抛光量的抛光量的值。 因此，基板研磨装置可以局部地调整基板的研磨量，提高抛光均匀性和产品成品率。

公开(公告)号：US20110021115A1

公开(公告)日：2011-01-27

申请号：US12805306

申请日：2010-07-23

申请人： Sehoon OH ,  Oh Jin KWON ,  Jang Hyun KIM

发明人： Sehoon OH ,  Oh Jin KWON ,  Jang Hyun KIM

IPC分类号： B24B49/00 ,  B24B7/22

CPC分类号： B24B37/04 ,  B24B49/00

摘要： Provided is a substrate polishing apparatus that includes a polishing unit and a pad supporting member. The polishing unit includes a polishing pad polishing a substrate seated on a substrate supporting member, and a pad driving member moving the polishing pad. The pad supporting member is disposed at a side of the substrate supporting member to support a portion of a polishing surface the polishing pad without contacting the substrate when an edge of the substrate seated on the substrate supporting member is polished. Accordingly, the substrate polishing apparatus prevents the polishing pad from being inclined to the outer side of a substrate while an edge of the substrate is polished, thereby improving polishing efficiency and preventing the breakage of a substrate during a polishing process.

摘要翻译： 提供了一种包括抛光单元和垫支撑构件的基板抛光装置。 抛光单元包括抛光坐在基板支撑构件上的基板的抛光垫和移动抛光垫的垫驱动构件。 当衬底支撑构件的边缘被抛光时，衬垫支撑构件设置在衬底支撑构件的一侧以支撑研磨表面的抛光垫的一部分而不与衬底接触。 因此，基板研磨装置防止抛光垫在基板的边缘被抛光时倾斜到基板的外侧，从而提高抛光效率并防止在抛光过程中基板的断裂。