公开(公告)号：US20180363883A1

公开(公告)日：2018-12-20

申请号：US16010669

申请日：2018-06-18

Applicant: Schreiner Group GmbH & Co. KG

Inventor： Johannes BECKER ,  Sebastian GEPP ,  Manfred HARTMANN ,  Hartmut WIEDERRECHT

IPC: F21V9/32 ,  F21K9/64

CPC classification number: F21V9/32 ,  F21K9/64 ,  F21V9/30 ,  F21V9/38 ,  F21Y2107/70 ,  F21Y2115/10 ,  G02B6/005 ,  G02B6/0088 ,  H01L33/507 ,  H01L2933/0091 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/055 ,  H05K2201/10106

Abstract: A foil structure with generation of visible light using LED technology includes a carrier foil and an LED chip for generation of UV light. The LED chip is disposed on the carrier foil and is provided with a light output face for emission of the UV light. Furthermore, the foil structure includes a color reaction layer for conversion of the UV light into the visible light. The color reaction layer is disposed above the LED chip or in a manner laterally offset relative to the LED chip. The color reaction layer is provided with a structuring, so that the UV light emitted from the light output face of the LED chip is not emitted into the surroundings of the foil structure.

公开(公告)号：US20180366627A1

公开(公告)日：2018-12-20

申请号：US16010667

申请日：2018-06-18

Applicant: Schreiner Group GmbH & Co. KG

Inventor： Johannes BECKER ,  Sebastian GEPP ,  Manfred HARTMANN ,  Hartmut WIEDERRECHT

IPC: H01L33/62 ,  H01L33/50 ,  H01L25/16 ,  H03K17/96 ,  G06K19/07

Abstract: A foil structure with generation of visible light via LED technology has a carrier foil and an LED chip for generation of UV light. The LED chip is disposed on a first portion of the carrier foil and is provided with a light output face for emission of the UV light. The foil structure further has a color reaction layer for conversion of the UV light into the visible light, wherein the color reaction layer is disposed on a second portion of the carrier foil. The carrier foil is folded over in such a way that the second portion of the carrier foil is disposed above the first portion of the carrier foil and the color reaction layer is disposed above the LED chip or in a manner laterally offset relative to the LED chip.