FLEXIBLE PACKAGING FOR MICROELECTRONIC DEVICES
    2.
    发明申请
    FLEXIBLE PACKAGING FOR MICROELECTRONIC DEVICES 有权
    用于微电子器件的柔性包装

    公开(公告)号:US20150114451A1

    公开(公告)日:2015-04-30

    申请号:US14068189

    申请日:2013-10-31

    摘要: An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

    摘要翻译: 一种装置,方法和系统,所述装置和系统包括支持柔性微系统的微电子器件封装,其包括位于衬底上的微电子器件; 封装微电子器件和衬底的封装层; 围绕所述封装层定位的保护层; 以及耦合到所述保护层的加强层,其中所述衬底,封装层,保护层和加强层在所述微电子器件周围形成柔性且光学透明的封装。 该方法包括封装位于封装层内的衬底上的微电子器件; 将封装的微电子器件密封在保护层内; 以及将所述保护层耦合到增强层,其中所述基底,包封层,保护层和增强层在所述微电子器件周围形成柔性且光学透明的封装。