公开(公告)号：US20250030176A1

公开(公告)日：2025-01-23

申请号：US18777234

申请日：2024-07-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jiantong Li ,  Aditya Dave ,  Yong Su ,  Xinguang Xu ,  Won Suk Choi ,  Gang Xu

IPC: H01Q21/24 ,  H01Q1/24 ,  H01Q21/06

Abstract: An apparatus includes a via-fed dual-polarized patch, a first capacitive-fed dual-polarized patch, and a second capacitive-fed dual-polarized patch. The first capacitive-fed dual-polarized patch is capacitively coupled to the via-fed dual-polarized patch through an air gap. The second capacitive-fed dual-polarized patch is capacitively coupled to the first capacitive-fed dual-polarized patch through a dielectric layer.