公开(公告)号：US20240155741A1

公开(公告)日：2024-05-09

申请号：US18306570

申请日：2023-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulmin CHO ,  Seunghwan KO ,  Wooseop SHIN ,  Minwoo KIM ,  Kyoungwhan OH

IPC: H05B3/34 ,  H05B3/12 ,  H05B3/54

CPC classification number: H05B3/34 ,  H05B3/12 ,  H05B3/54 ,  H05B2203/002

Abstract: A substrate processing apparatus includes a chamber providing a space configured to process a substrate and a heating plate arranged within the chamber, the heating plate including a substrate plate configured to support the substrate and having a first region, a second region and a third region sequentially arranged in a radial direction from a center of the substrate plate, and a liquid metal pattern patterned on the substrate plate and extending on the first region, the second region and the third region, the substrate plate being stretchable.