SPEAKER ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20250030790A1

    公开(公告)日:2025-01-23

    申请号:US18776853

    申请日:2024-07-18

    Abstract: An electronic device is provided. The electronic device includes a housing including a first speaker hole and a speaker assembly disposed in the housing and configured to radiate a sound to an outside of the electronic device through the first speaker hole, wherein the speaker assembly includes a speaker including a diaphragm, a first speaker cover facing the diaphragm and spaced apart from the diaphragm, a sound space formed between the diaphragm and the first speaker cover, a first supporting structure including a first portion formed to surround a portion of the sound space, and a step structure disposed adjacent to an area where a portion of the first portion of the first supporting structure contacts the first speaker cover and disposed to be spaced apart from the speaker.

    ELECTRONIC DEVICE INCLUDING VIBRATION DAMPING MEMBER

    公开(公告)号:US20200275191A1

    公开(公告)日:2020-08-27

    申请号:US16749808

    申请日:2020-01-22

    Abstract: An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.

    ELECTRONIC DEVICE HAVING SPEAKER
    8.
    发明申请

    公开(公告)号:US20210034119A1

    公开(公告)日:2021-02-04

    申请号:US16939688

    申请日:2020-07-27

    Abstract: An electronic device is provided. The electronic device includes a housing including a first plate disposed to face a first direction, a second plate disposed to face a second direction opposite to the first direction, and a side member enclosing at least part of a space between the first and second plates and having at least one speaker hole constructed thereon, and a speaker device disposed between the first and second plates to emit a sound through the speaker hole. The speaker device may include: a speaker unit including a yoke disposed to a first face facing the first direction and a diaphragm disposed to a second face facing the second direction, wherein the diaphragm is disposed to face the second direction, and is disposed to face at least part of the second plate, an enclosure shaped to enclose at least part of the speaker unit and disposed between the first and second plates, an acoustic duct constructed between the enclosure and the second plate and extending towards the at least one speaker hole, and a ferromagnetic material disposed between the first plate and the yoke.

    ELECTRONIC DEVICE HAVING STRUCTURE INCLUDING SENSOR AND SPEAKER

    公开(公告)号:US20190166422A1

    公开(公告)日:2019-05-30

    申请号:US16093269

    申请日:2017-04-14

    Abstract: An electronic device according to an embodiment of the present invention may have a structure including a sensor and a speaker. The structure may comprise: a first passage portion connected to the speaker; a second passage portion connected to the sensor; and a shared passage portion connected to the first passage portion and the second passage portion and leading to the outside of the structure. According to an embodiment, a sound output from the speaker is emitted to the outside of the structure through the first passage portion and the common passage portion, and a medium introduced from the outside of the structure may come into contact with the sensor through the common passage portion and the second passage portion. Various other embodiments are possible.

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