公开(公告)号：US20240015946A1

公开(公告)日：2024-01-11

申请号：US18348864

申请日：2023-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyooho JUNG ,  Wonsik CHOI

IPC: H10B12/00

CPC classification number: H10B12/03 ,  H10B12/315 ,  H10B12/482 ,  H01L28/91

Abstract: A method of manufacturing an integrated circuit device includes forming a plurality of lower electrodes above a substrate, forming a dielectric film on the plurality of lower electrodes, forming a doped upper interface film on the dielectric film, and forming an upper electrode on the doped upper interface film, wherein the doped upper interface film includes a dopant, and the dopant includes one selected from tin (Sn), molybdenum (Mo), niobium (Nb), tantalum (Ta), and aluminum (Al).

公开(公告)号：US20240413129A1

公开(公告)日：2024-12-12

申请号：US18626034

申请日：2024-04-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonsik CHOI ,  Byungchul KIM ,  Yoonsuk LEE ,  Mingyu LEE ,  Seungryong HAN

IPC: H01L25/075 ,  H01L21/683

Abstract: A transfer substrate for a light emitting diode is provided. The transfer substrate includes a substrate, a laser ablation layer provided to the substrate, and an adhesive layer provided on the laser ablation layer and attached with a plurality of light emitting diodes, and the laser ablation layer and the adhesive layer may be divided into a plurality of portions corresponding to the plurality of light emitting diodes.

公开(公告)号：US20220375907A1

公开(公告)日：2022-11-24

申请号：US17880027

申请日：2022-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonsik CHOI ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

公开(公告)号：US20240015949A1

公开(公告)日：2024-01-11

申请号：US18333213

申请日：2023-06-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyooho JUNG ,  Jongyeong MIN ,  Jiye BAEK ,  Yeseul LEE ,  Jinwook LEE ,  Wonsik CHOI

IPC: H10B12/00

CPC classification number: H10B12/315 ,  H10B12/0335 ,  H10B12/34

Abstract: An integrated circuit device may include a plurality of lower electrodes above a substrate, a supporter between the plurality of lower electrodes, an upper electrode on the plurality of lower electrodes, and a capacitor dielectric film between the upper electrode and the plurality of lower electrodes. The supporter may include one of a metal oxide, a metal nitride, and a metal oxynitride. A portion of the capacitor dielectric film may include a dopant. The dopant in the portion of the capacitor dielectric film and a metal in the supporter may be a same metal.

公开(公告)号：US20210202787A1

公开(公告)日：2021-07-01

申请号：US17133171

申请日：2020-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH ,  Wonsik CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: A light emitting diode (LED) transfer system includes an alignment apparatus configured to align a plurality of target substrates; a handling robot configured to transport the plurality of target substrates; a transfer stage configured to hold the plurality of target substrates and move the plurality of target substrates; a substrate stage configured to move a relay substrate having a plurality of LEDs with respect to the transfer stage while the plurality of LEDs are facing the transfer stage; a laser configured to emit a laser beam toward the plurality of LEDs of the relay substrate so that the plurality of LEDs are transferred from the relay substrate to the plurality of target substrates; and a processor configured to control the alignment apparatus, the handling robot, the transfer stage, the substrate stage, and the laser to transfer the plurality of LEDs of the relay substrate to the plurality of target substrates.

公开(公告)号：US20240429043A1

公开(公告)日：2024-12-26

申请号：US18504712

申请日：2023-11-08

Applicant: Samsung Electronics Co., Ltd. ,  AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Jeonggyu SONG ,  Ilkwon OH ,  Beomseok KIM ,  Jooho LEE ,  Wonsik CHOI ,  Byungjun WON ,  Minjeong RHEE

IPC: H01L21/02 ,  C23C16/34 ,  C23C16/40 ,  C23C16/455

Abstract: Provided is a method of forming an insulating film on a substrate by using atomic layer deposition (ALD). The method of forming an insulating film on a substrate by using ALD includes transferring a deposition-hindering material to the substrate, and depositing a first material layer by transferring a first precursor to the deposition-hindering material, wherein the deposition-hindering material includes an organic ligand, and the first precursor includes an alkoxide ligand.

公开(公告)号：US20240170212A1

公开(公告)日：2024-05-23

申请号：US18350600

申请日：2023-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonggyu SONG ,  Eunae CHO ,  Narae HAN ,  Beomseok KIM ,  Cheheung KIM ,  Jooho LEE ,  Wonsik CHOI

IPC: H01G4/10 ,  H01L29/51 ,  H01L29/94 ,  H10B12/00

CPC classification number: H01G4/10 ,  H01L28/60 ,  H01L28/65 ,  H01L29/511 ,  H01L29/517 ,  H01L29/94 ,  H10B12/31 ,  H01G4/1236

Abstract: A capacitor, a semiconductor device, and an electronic apparatus including the semiconductor device are disclosed. The capacitor includes a first electrode; a second electrode disposed apart from the first electrode; a dielectric film between the first electrode and the second electrode; and a leakage current reducing layer provided on the dielectric film between the first electrode and the second electrode and including MxAlyOz.

公开(公告)号：US20220384675A1

公开(公告)日：2022-12-01

申请号：US17885164

申请日：2022-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Wonsik CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for repairing a display module and a display module repaired by the method are provided. The method for repairing a display module includes: detecting light-emitting diode (LED) missing positions on a target substrate; loading the target substrate onto a first stage; loading a transfer substrate onto a second stage; arranging the target substrate and the transfer substrate by operating the first stage and the second stage; and transferring a laser consecutively to the LED missing positions by moving the target substrate and the transfer substrate at a constant speed by operating the first stage and the second stage in a row direction or a column direction.