公开(公告)号：US20220262757A1

公开(公告)日：2022-08-18

申请号：US17736536

申请日：2022-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeho KO ,  Daehee LEE ,  Hyunchul JUNG

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor device may include a semiconductor chip in an encapsulant. A first insulation layer may be disposed on the encapsulant and the semiconductor chip. A horizontal wiring and a primary pad may be disposed on the first insulation layer. A secondary pad may be disposed on the primary pad. A second insulation layer covering the horizontal wiring may be disposed on the first insulation layer. A solder ball may be disposed on the primary pad and the secondary pad. The primary pad may have substantially the same thickness as a thickness of the horizontal wiring.

公开(公告)号：US20210217720A1

公开(公告)日：2021-07-15

申请号：US16983296

申请日：2020-08-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeho KO ,  Daehee LEE ,  Hyunchul JUNG

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor device may include a semiconductor chip in an encapsulant. A first insulation layer may be disposed on the encapsulant and the semiconductor chip. A horizontal wiring and a primary pad may be disposed on the first insulation layer. A secondary pad may be disposed on the primary pad. A second insulation layer covering the horizontal wiring may be disposed on the first insulation layer. A solder ball may be disposed on the primary pad and the secondary pad. The primary pad may have substantially the same thickness as a thickness of the horizontal wiring.