公开(公告)号：US11601539B2

公开(公告)日：2023-03-07

申请号：US17092716

申请日：2020-11-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nakhyun Choi ,  Hojong Kim ,  Hanbom Park ,  Sungkeun Koo ,  Jaeyoung Huh

IPC: H04M1/03 ,  G06F1/16 ,  H04R1/08 ,  H04R1/04

Abstract: In accordance with one aspect of the disclosure, an electronic device comprises a plate at least partially forming one surface of a housing and including a first through-hole; a printed circuit board disposed in the housing under the plate, the printed circuit having a second through-hole at least partly overlapping the first through-hole when viewed from above the first surface; a microphone disposed on a surface of the printed circuit board facing away from the plate, and at least partly overlapping the second through-hole when viewed from above the first surface; a seal member that is disposed between the plate and the printed circuit board around the first through-hole or the second through-hole; a support member that includes a first portion that faces the printed circuit board and includes an opening, the opening penetrated by the microphone, and a second portion that extends from the first portion and faces the plate; a first fixture the printed circuit board and the first portion; and a second fixture that is disposed between the plate and the second portion.