公开(公告)号：US20250081375A1

公开(公告)日：2025-03-06

申请号：US18756211

申请日：2024-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungchul HUR ,  Bumjun KIM

IPC: H05K7/14 ,  H01R12/77 ,  H05K1/02

Abstract: A solid state drive apparatus includes a housing including a top cover and a bottom cover that define an internal space of the housing, and a plurality of package substrate modules accommodated in the internal space of the housing. The package substrate modules include a top package substrate module having a top package base substrate, and a bottom package substrate module having a bottom package base substrate. The top package substrate module and the bottom package substrate module are separated from each other in a vertical direction. The top package base substrate includes a plurality of top protrusions and a plurality of top notches, and the bottom package base substrate includes a plurality of bottom protrusions and a plurality of bottom notches.