公开(公告)号：US11926695B2

公开(公告)日：2024-03-12

申请号：US16898761

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Pang ,  In Kim ,  Jonghoon Won ,  Mooho Lee ,  Hyejeong Lee ,  Songwon Hyun

IPC: C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

CPC classification number: C08G59/245 ,  C08G59/26 ,  C08G59/621 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/641

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.

E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1

In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

公开(公告)号：US11827741B2

公开(公告)日：2023-11-28

申请号：US17546294

申请日：2021-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changho Noh ,  Insu Lee ,  Songwon Hyun ,  Yoonseok Ko ,  Mijeong Kim ,  Keechang Lee ,  Sangsoo Jee

IPC: C08G59/24 ,  C08K3/013 ,  C08G59/62 ,  C08L63/00

CPC classification number: C08G59/245 ,  C08G59/621 ,  C08K3/013 ,  C08L63/00 ,  C08G2170/00 ,  C08G2190/00 ,  C08K2201/001 ,  C08L2203/206

Abstract: An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:

E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2  Formula 1

E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4  Formula 2

In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

公开(公告)号：US20220185947A1

公开(公告)日：2022-06-16

申请号：US17546294

申请日：2021-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changho Noh ,  Insu Lee ,  Songwon Hyun ,  Yoonseok Ko ,  Mijeong Kim ,  Keechang Lee ,  Sangsoo Jee

IPC: C08G59/24 ,  C08G59/62 ,  C08K3/013 ,  C08L63/00

Abstract: An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound: E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2  Formula 1 E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4  Formula 2 In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

公开(公告)号：US20210147612A1

公开(公告)日：2021-05-20

申请号：US16898761

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Pang ,  In Kim ,  Jonghoon Won ,  Mooho Lee ,  Hyejeong Lee ,  Songwon Hyun

IPC: C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08L63/00 ,  C09D163/00 ,  C09D5/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.