公开(公告)号：US20170125647A1

公开(公告)日：2017-05-04

申请号：US15216137

申请日：2016-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： HUN-YONG PARK ,  Choo-ho KIM ,  Song-ho JEONG ,  Jong-ho LIM

IPC: H01L33/50 ,  H01L33/30 ,  H01L33/38

CPC classification number: H01L33/505 ,  H01L33/30 ,  H01L33/382 ,  H01L33/486 ,  H01L33/504 ,  H01L33/56 ,  H01L2933/0041

Abstract: A light-emitting diode (LED) package includes an LED chip, a phosphor film adhered to a top surface of the LED chip, and a molding phosphor covering a side surface of the LED chip.