公开(公告)号：US20220293565A1

公开(公告)日：2022-09-15

申请号：US17531115

申请日：2021-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Hun SHIN ,  Un Byoung KANG ,  Yeong Kwon KO ,  Jong Ho LEE ,  Teak Hoon LEE ,  Jun Yeong HEO

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/498 ,  H01L23/31

Abstract: There is provided a semiconductor device comprising a first semiconductor chip which includes a first chip substrate, and a first through via penetrating the first chip substrate, a second semiconductor chip disposed on the first semiconductor chip, and includes a second chip substrate, and a second through via penetrating the second chip substrate, and a connecting terminal disposed between the first semiconductor chip and the second semiconductor chip to electrically connect the first through via and the second through via. The semiconductor device further comprising an inter-chip molding material which includes a filling portion that fills between the first semiconductor chip and the second semiconductor chip and encloses the connecting terminal, an extension portion that extends along at least a part of a side surface of the second semiconductor chip, and a protruding portion protruding from the extension portion.

公开(公告)号：US20240379626A1

公开(公告)日：2024-11-14

申请号：US18780917

申请日：2024-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Hun SHIN ,  Un Byoung KANG ,  Yeong Kwon KO ,  Jong Ho LEE ,  Teak Hoon LEE ,  Jun Yeong HEO

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: There is provided a semiconductor device comprising a first semiconductor chip which includes a first chip substrate, and a first through via penetrating the first chip substrate, a second semiconductor chip disposed on the first semiconductor chip, and includes a second chip substrate, and a second through via penetrating the second chip substrate, and a connecting terminal disposed between the first semiconductor chip and the second semiconductor chip to electrically connect the first through via and the second through via. The semiconductor device further comprising an inter-chip molding material which includes a filling portion that fills between the first semiconductor chip and the second semiconductor chip and encloses the connecting terminal, an extension portion that extends along at least a part of a side surface of the second semiconductor chip, and a protruding portion protruding from the extension portion.