公开(公告)号：US20150241936A1

公开(公告)日：2015-08-27

申请号：US14628494

申请日：2015-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun HUR ,  Seung Ki CHOI ,  Seung Bum CHOI

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1656 ,  H01L23/367 ,  H05K1/0203 ,  H05K7/2039 ,  H05K9/0024

Abstract: A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.

Abstract translation: 提供了硬件屏蔽装置和电子装置。 所述装置和电子装置包括屏蔽罩，其包括开口，至少一部分装置元件暴露在该开口中;散热模块，至少包括安装在所述开口上的部分，连接到所述开口的一个表面的盖构件 散热模块和布置在屏蔽罐与盖构件之间的导体，导体围绕散热模块的开口和周边的至少一部分。

公开(公告)号：US20180217006A1

公开(公告)日：2018-08-02

申请号：US15883340

申请日：2018-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Bum CHOI ,  Joo Hyun KIM ,  Soo Hyun PARK ,  Doo Sun YOON ,  Min Woo YOO ,  Jong Chul CHOI

IPC: G01K5/52 ,  G01K13/00 ,  H01M10/42

CPC classification number: G01K5/52 ,  G01K7/223 ,  G01K13/00 ,  H01M10/4285 ,  H01M10/486 ,  H01M2200/10 ,  H01M2220/30

Abstract: An electronic device is provided. The electronic device includes a substrate, a coil unit comprising a coil disposed on a specified area of the substrate and configured to transmit or receive a signal, a first terminal, a second terminal, and a temperature sensor configured to detect temperature. The temperature sensor has a wire form and is disposed between the first terminal and the second terminal along at least part of a peripheral area of the substrate.