公开(公告)号：US20140045286A1

公开(公告)日：2014-02-13

申请号：US14058152

申请日：2013-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol Jun YOO ,  Young Hee SONG ,  Seong Deok HWANG ,  Sang Hyun LEE

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.

Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。

公开(公告)号：US20160276536A1

公开(公告)日：2016-09-22

申请号：US15170115

申请日：2016-06-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hyun LEE ,  Seong Deok HWANG

IPC: H01L33/22 ,  H01L33/32 ,  H01L33/62 ,  H01L33/56 ,  H01L33/50 ,  H01L33/58 ,  H01L33/06 ,  H01L33/00

CPC classification number: H01L33/22 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/24 ,  H01L33/32 ,  H01L33/44 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/502 ,  H01L33/507 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.

Abstract translation: 提供一种发光器件（LED）封装及其制造方法。 LED封装包括LED，其包括设置在其一个表面上的第一电极焊盘和第二电极焊盘; 接合绝缘图案层，被配置为暴露所述第一电极焊盘和所述第二电极焊盘; 包括从第一表面到第二表面钻孔的通孔的基板和形成在通孔的内表面上以延伸到第二表面的一部分的布线金属层; 以及接合金属图案层，其结合到在基板的第一表面处通过通孔暴露的布线金属层，并且还结合到第一电极焊盘和第二电极焊盘。

公开(公告)号：US20130234274A1

公开(公告)日：2013-09-12

申请号：US13785152

申请日：2013-03-05

Applicant: SAMSUNG ELECTRONICS CO., LTD ,  KOREA PHOTONICS TECHNOLOGY INSTITUTE

Inventor： Dong Hyuck KAM ,  Seong Deok HWANG ,  Jae Pil KIM ,  Sang Bin SONG ,  Wan Ho KIM ,  Sie Wook JEON

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: There is provided a light emitting apparatus including: at least one pair of lead frames; a light emitting device electrically connected to the lead frames to emit ultraviolet rays; a body including a side wall surrounding the light emitting device, and a groove portion formed in an upper surface of the side wall to receive an adhesive; and a lens part disposed above the light emitting device and fixed to the upper surface of the side wall of the body by the adhesive.

Abstract translation: 提供一种发光装置，包括：至少一对引线框; 电连接到引线框架以发射紫外线的发光器件; 包括围绕所述发光装置的侧壁的主体和形成在所述侧壁的上表面中以容纳粘合剂的槽部; 以及设置在发光器件上方并通过粘合剂固定到本体侧壁的上表面的透镜部分。

公开(公告)号：US20130236997A1

公开(公告)日：2013-09-12

申请号：US13791057

申请日：2013-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hyun LEE ,  Gam Han YONG ,  Seong Deok HWANG

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/0079 ,  H01L2224/32225 ,  H01L2933/0033

Abstract: A light emitting device and a method for fabricating the same are provided. The method includes: forming a plurality of light emitting laminates in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially laminated on a growth substrate; mounting the growth substrate on a substrate including a plurality of terminal units each including a pair of electrode terminals; electrically connecting the second conductivity-type semiconductor layer of each of the light emitting laminates to a first electrode terminal of a corresponding terminal unit; removing the growth substrate to expose the first conductivity-type semiconductor layer; forming an insulating layer on a lateral surface of each of the plurality of light emitting laminates; and electrically connecting the exposed first conductivity-type semiconductor layer of each of the light emitting laminates to a second electrode terminal of the corresponding terminal unit.

Abstract translation: 提供一种发光器件及其制造方法。 该方法包括：形成多个发光层压板，其中第一导电类型半导体层，有源层和第二导电类型半导体层依次层压在生长衬底上; 将生长衬底安装在包括多个端子单元的衬底上，每个端子单元包括一对电极端子; 将每个发光层压板的第二导电类型半导体层电连接到相应的端子单元的第一电极端子; 去除所述生长衬底以暴露所述第一导电型半导体层; 在所述多个发光层压板的每一个的侧表面上形成绝缘层; 并且将每个发光层压板的暴露的第一导电类型半导体层电连接到相应的端子单元的第二电极端子。