公开(公告)号：US20170301578A1

公开(公告)日：2017-10-19

申请号：US15396929

申请日：2017-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Pyo HONG ,  Sang-Dong Kwon ,  Kwang-Nam Kim ,  Jong-Woo Sun ,  Sang-Rok Oh

IPC: H01L21/687 ,  H01J37/32 ,  B08B9/08 ,  B08B7/00 ,  H01L21/67

CPC classification number: H01L21/68721 ,  B08B7/00 ,  B08B9/08 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32633 ,  H01J37/32642 ,  H01J37/32733 ,  H01J37/32853 ,  H01J37/32862 ,  H01J37/3288 ,  H01J2237/002 ,  H01J2237/334 ,  H01L21/67069

Abstract: A method of processing a substrate including loading the substrate into a plasma-processing apparatus. The plasma-processing apparatus includes a focus ring. The substrate is processed in the plasma-processing apparatus using plasma. The substrate is unloaded from the plasma-processing apparatus. A layer is formed on the focus ring. The layer is formed by an in-situ process in the plasma-processing apparatus.

公开(公告)号：US10062550B2

公开(公告)日：2018-08-28

申请号：US15142629

申请日：2016-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Pyo Hong ,  Kwang-Nam Kim ,  Sang-Dong Kwon ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Yong-Moon Jang

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32009 ,  H01J37/321 ,  H01J37/32119 ,  H01L21/67248

Abstract: Provided are substrate processing apparatuses including a temperature measurement unit. The substrate processing apparatus comprises a chamber including a substrate processing region, a dielectric sheet that is disposed on the substrate processing region and includes an insertion hole and a temperature measurement unit that is disposed on the dielectric sheet to measure the temperature of the dielectric sheet, and has a screw portion inserted into the insertion hole, wherein each of the insertion hole and the screw portion has thread helixes meshed with each other.