公开(公告)号：US20140103386A1

公开(公告)日：2014-04-17

申请号：US14106446

申请日：2013-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hyun SHIN ,  Seong Moon CHOI ,  Young Ki LEE

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

Abstract translation: 本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。

公开(公告)号：US20130026901A1

公开(公告)日：2013-01-31

申请号：US13625517

申请日：2012-09-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Ki LEE ,  Seog Moon CHOI ,  Hyung Jin JEON ,  Sang Hyun SHIN

IPC: H05B33/02 ,  H05B33/10

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48227

Abstract: The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

Abstract translation: 本发明涉及一种发光器件封装及其制造方法。 提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。