公开(公告)号：US20250148174A1

公开(公告)日：2025-05-08

申请号：US18934812

申请日：2024-11-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaewon LEE ,  Namyeong KWON

IPC: G06F30/27 ,  G06F119/18 ,  G06F119/22

Abstract: A method and a device for predicting a yield of an in-fab wafer including: generating at least one virtual process path on a residual process of the in-fab wafer; and predicting the yield of a virtual fab-out wafer that corresponds to the at least one virtual process path by using a trained yield predicting model are provided.

公开(公告)号：US20240201638A1

公开(公告)日：2024-06-20

申请号：US18330692

申请日：2023-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namyeong KWON ,  Inchul SONG

IPC: G05B13/02 ,  G05B13/04

CPC classification number: G05B13/0265 ,  G05B13/042

Abstract: A method and device with process attribution identification are provided. The method may include generating a process result using a first machine learning model provided input data, where the input data incudes feature values corresponding to a plurality of process features, generating sample data by a first modifying of at least a portion of reference data based on dependency between two or more of the plurality of process features, where the reference data includes a plurality of feature values for a reference process result, identifying an attribution of the plurality of process features based on the generated process result and a sample process result generated using the first machine learning model, or a second machine learning model related to the first machine learning model, provided the generated sample data.