公开(公告)号：US20210029855A1

公开(公告)日：2021-01-28

申请号：US16899118

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong YOON ,  Myunghoon KWAK ,  Minki PARK ,  Youngjae YOU ,  Yongsang YUN

IPC: H05K9/00 ,  H05K7/20 ,  H01L23/40 ,  H01L23/552

Abstract: An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

公开(公告)号：US20210385941A1

公开(公告)日：2021-12-09

申请号：US17282467

申请日：2019-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki PARK

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20 ,  H05K5/00 ,  H05K9/00 ,  H01R12/77

Abstract: An electronic device according to various embodiments of the disclosure may include: a housing which includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member covering at least part of the space between the first and second plates; a display disposed to be visible in at least part of the first plate; a first circuit board which includes a first face facing the first direction and a second face facing the second direction, and which is disposed in the second direction of the display; a second circuit board which is disposed not to overlap at least in part with the first printed circuit board, and which is electrically coupled with the first circuit board; a socket mounted to the second circuit board; at least one or more metal structures disposed on the first circuit board to transfer, to another component, heat of at least one or more exothermic elements mounted on the first circuit board; and a ground path constructed in at least part of the second circuit board so as to be electrically coupled to the first circuit board or the metal member or the first circuit board and the metal structure.