公开(公告)号：US20250140677A1

公开(公告)日：2025-05-01

申请号：US18739665

申请日：2024-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Jeong SHIN ,  Duck Gyu KIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/10

Abstract: A semiconductor package includes a redistribution substrate including a first surface and a second surface, which are opposite to each other in a first direction, a semiconductor chip mounted on the first surface of the redistribution substrate, a redistribution pattern in the redistribution substrate and electrically connected to the semiconductor chip, a metal pattern electrically connected to the redistribution pattern, including a third surface and a fourth surface, which are opposite to each other in the first direction, and a connection terminal on the second surface of the redistribution substrate and being in contact with the fourth surface of the metal pattern, wherein at least a portion of the redistribution pattern is in contact with sidewalls of the metal pattern, wherein the third surface faces the semiconductor chip and is not in contact with the redistribution pattern, and wherein the fourth surface does not overlap the second surface in the first direction.