Abstract:
A method of inspecting a resistive defect of a semiconductor device is provided. The method includes loading a semiconductor wafer on a wafer stocker, transferring the semiconductor wafer into a laser anneal module, annealing a portion of the semiconductor wafer using a laser beam in an atmospheric pressure, transferring the annealed semiconductor wafer into an E-beam scanning module in a vacuum, scanning the annealed portions of the semiconductor wafer with an E-beam, and collecting secondary electrons emitted from the annealed portions of the semiconductor wafer.
Abstract:
An electronic device and method are provided for sensing a touch or hovering event, where sensor variations due to environmental temperatures are minimized. The method includes operations for measuring a temperature of a portion of an electronic device, setting a sensing state reference level of a grip sensor according to the measured temperature, and determining a sensing state of an external object for the electronic device according to a result of a comparison between an output level from the grip sensor and the sensing state reference level of the grip sensor.