公开(公告)号：US20230247804A1

公开(公告)日：2023-08-03

申请号：US17720264

申请日：2022-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Matthew BRYSON ,  Luka DAOUD ,  Sompong Paul OLARIG

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20272 ,  H05K7/20263 ,  H05K7/20836

Abstract: A chassis may include a member. The member may include a system channel for a liquid coolant to flow and a slot in the member for a storage device. A liquid cooling block may be associated with the slot in the member. The liquid cooling block may include a block channel for the liquid coolant to flow to remove heat from the storage device.