公开(公告)号：US20240074051A1

公开(公告)日：2024-02-29

申请号：US18503974

申请日：2023-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghyun SEOK ,  Kyeongseon PARK

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K2201/09409

Abstract: A printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. The pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. The dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.

公开(公告)号：US20220418105A1

公开(公告)日：2022-12-29

申请号：US17672979

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghyun SEOK ,  Kyeongseon PARK

IPC: H05K1/11

Abstract: A printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. The pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. The dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.