公开(公告)号：US20250132185A1

公开(公告)日：2025-04-24

申请号：US18825121

申请日：2024-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghwa Kim ,  Daeho Min ,  Yunha Kim ,  Kwanghyun Cho ,  Kyeongbin Lim

IPC: H01L21/683 ,  H01L21/67

Abstract: A cooling system for semiconductor equipment includes a chamber, an electrostatic chuck in the chamber, a coolant pipe housing in at least one of the chamber and the electrostatic chuck, the coolant pipe housing having an internal space, a coolant pipe at least partially in the internal space of the coolant pipe housing, and a flow controller configured to control a flow velocity of the coolant flowing along the coolant pipe so that the flow velocity periodically reaches a highest speed and a lowest speed.

公开(公告)号：US11314814B2

公开(公告)日：2022-04-26

申请号：US16382763

申请日：2019-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heesuk Cho ,  Wooyong Sung ,  Kwanghyun Cho ,  Jisoo Choi

IPC: G06F16/9035 ,  H04L29/08 ,  H04L29/06 ,  G06F16/907 ,  H04L67/10 ,  H04L67/01

Abstract: Disclosed is a method for sharing a content by an electronic device using a cloud service. The method may include: accessing a cloud server through a specified account; displaying a user interface including a list of contents based on a content application being executed; determining at least one shared content to be shared on the cloud server in response to receiving a first input through the user interface; determining an account group on the cloud server accessible to the shared content in response to receiving a second input through the user interface; and transmitting the shared content and information related to the determined account group to the cloud server in response to receiving a third input through the user interface.