公开(公告)号：US20140252402A1

公开(公告)日：2014-09-11

申请号：US14197889

申请日：2014-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kun-jeong LEE ,  Young-jin CHO

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/16245

Abstract: A light-emitting diode (LED) package includes a package substrate, a first electrode pad, a second electrode pad, an upper insulating layer and an LED chip. The first electrode pad is disposed on an upper surface of the package substrate and includes a groove. The second electrode pad includes a protruding portion disposed in the groove of the first electrode pad. The upper insulating layer insulates the first electrode pad from the second electrode pad on the package substrate. The LED chip includes a first electrode and a second electrode which are respectively electrically connected in the form of a flip-chip to the first electrode pad and the protruding portion of the second electrode pad.

Abstract translation: 发光二极管（LED）封装包括封装衬底，第一电极焊盘，第二电极焊盘，上绝缘层和LED芯片。 第一电极焊盘设置在封装基板的上表面上并且包括凹槽。 第二电极焊盘包括设置在第一电极焊盘的凹槽中的突出部分。 上绝缘层将第一电极焊盘与第二电极焊盘绝缘在封装衬底上。 LED芯片包括分别以倒装芯片的形式电连接到第一电极焊盘和第二电极焊盘的突出部分的第一电极和第二电极。