公开(公告)号：US20190066689A1

公开(公告)日：2019-02-28

申请号：US16104192

申请日：2018-08-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongmin JE ,  Jaeyung YEO ,  Taekwang UM ,  Jungmin CHO

IPC: G10L15/30 ,  G10L13/04 ,  G10L15/22 ,  G06F3/16

CPC classification number: G10L15/30 ,  G06F3/167 ,  G10L13/04 ,  G10L15/22 ,  G10L2015/223 ,  H04L12/2816 ,  H04L67/36

Abstract: Disclosed are an electronic device and a method of controlling an operation of the electronic device. A method comprises receiving first data related to an input comprising a request for performing a task using a second external device and obtained through a microphone and comprising information on a user interface of a first external device from the first external device, identifying a sequence of states of the second external device for executing the task based on at least some of the first data, transmitting first information on the sequence of states of the second external device to the second external device through the network interface, receiving second data indicative of a need for an additional input for completing the task from the second external device through the network interface, and transmitting second information to the first external device based on at least some of the second data.

公开(公告)号：US20230309058A1

公开(公告)日：2023-09-28

申请号：US18327441

申请日：2023-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kibong LEE ,  Nahyang KIM ,  Min SAKONG ,  Gaeun LEE ,  Jungmin CHO ,  Injin HWANG

IPC: H04W64/00 ,  H04W8/00

CPC classification number: H04W64/006 ,  H04W8/005

Abstract: An electronic device includes at least one sensor, a first communication module supporting a first communication scheme and configured to transmit a signal for discovery of an external electronic device configured to support a second communication scheme, and receive a first response signal from the external electronic device, and a second communication module supporting the second communication scheme and configured to perform at least one first operation for identifying the location of the external electronic device based on identification that the external electronic device supports the second communication scheme on the basis of the first response signal, and perform at least one second operation for adjusting the location of the external electronic device, based on a first orientation of the electronic device identified based on the at least one sensor, and based on a second orientation of the external electronic device obtained through the first communication module.

公开(公告)号：US20210127245A1

公开(公告)日：2021-04-29

申请号：US17079749

申请日：2020-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chanyeol PARK ,  Seungseok KANG ,  Wonsik SONG ,  Jungmin CHO ,  Chunho PARK ,  Wonick AHN ,  Hojun JAYGARL

IPC: H04W4/80 ,  H04W76/14 ,  H04W12/00 ,  H04W12/06

Abstract: An electronic device and method are disclosed herein. The electronic device includes memory storing a certificate list including first certificate data of the electronic device, and second certificate data of an external electronic device, a short-range wireless communication circuit, and a processor. The processor implements the method, including: detecting a trigger event for requesting establishment a communication connection with a device local to the electronic device, controlling the short-range wireless communication circuit to broadcast an advertisement packet generated based on the first certificate data, in response to detecting the trigger event, receiving a response packet from the external electronic device and acquire a third certificate data from the received response packet, authenticating the external electronic device based on the second certificate data and the third certificate data, and establishing a secure communication channel with the external electronic device if the external electronic device is authenticated.

公开(公告)号：US20250048717A1

公开(公告)日：2025-02-06

申请号：US18745614

申请日：2024-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hokyun AN ,  Kibum LEE ,  Jungmin CHO ,  Sunggyu CHOI

IPC: H01L21/8238 ,  H01L21/225 ,  H01L21/265 ,  H01L21/324

Abstract: A method of manufacturing a semiconductor device includes forming, on a substrate, a semiconductor material layer including germanium, forming a diffusion material layer in an upper portion of the substrate adjacent to the semiconductor material layer by performing a first heat treatment on the semiconductor material layer, removing the semiconductor material layer, recrystallizing the diffusion material layer by performing a second heat treatment on the diffusion material layer, and forming a fin-type structure by removing at least a portion of the substrate and at least a portion of the diffusion material layer. The diffusion material layer includes germanium diffused from the semiconductor material layer. A germanium concentration in the fin-type structure decreases from an upper surface of the fin-type structure toward a lower surface of the fin-type structure along a vertical direction perpendicular to a top surface of the substrate.

公开(公告)号：US20250030165A1

公开(公告)日：2025-01-23

申请号：US18788993

申请日：2024-07-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiho KIM ,  Junwoo KIM ,  Kyungjae LEE ,  Sungjun LEE ,  Jungmin CHO ,  Soonho HWANG

IPC: H01Q5/378 ,  H01Q1/24 ,  H01Q5/50 ,  H04M1/02

Abstract: An electronic device includes: a first housing; a second housing; a hinge structure coupled with the first and second housings so that the first and second housings are foldable relative to each other; and a wireless communication circuit on the second housing, wherein the second housing includes: a sixth side portion; a fifth side portion facing the sixth side portion; a fourth side portion facing the hinge structure; a third corner portion between the sixth side portion and the fourth side portion; a fourth corner portion between the fifth side portion and the fourth side portion; and a first matching circuit coupled with the sixth side portion and configured to induce a second surface current having a second phase opposite to a first phase of a first surface current induced on the first and second housings and the hinge structure based on the electronic device being in a folded state.

公开(公告)号：US20210250744A1

公开(公告)日：2021-08-12

申请号：US17169965

申请日：2021-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungseok KANG ,  Seunggyu KONG ,  Hyungeun KIM ,  Jungmin CHO ,  Gajin SONG ,  Sunkey LEE

IPC: H04W4/80 ,  H04L29/08 ,  H04W4/23 ,  H04W76/14 ,  H04W52/02

Abstract: An electronic device is provided. The electronic device includes a first communication circuit, a second communication circuit supporting a wireless protocol different from the first communication circuit, a display, a processor operatively connected to the first communication circuit, the second communication circuit, and the display, and a memory. The processor is configured to identify at least one external electronic device by using the first communication circuit, transmit, to a first external electronic device, a state change request for causing the first external electronic device to transition to a first state if state change information indicating that the first external electronic device has transitioned from the first state to a second state is received before transmitting data to the first external electronic device.