公开(公告)号：US11612066B2

公开(公告)日：2023-03-21

申请号：US17301845

申请日：2021-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghyun Im ,  Hyosang Lim ,  Heekwang Lim ,  Seungchang Baek ,  Hyeongsam Son ,  Sungho Cho ,  Hangyu Hwang ,  Jongchul Choi

IPC: H05K5/02 ,  H05K5/00

Abstract: An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening.

公开(公告)号：US12101901B2

公开(公告)日：2024-09-24

申请号：US17590039

申请日：2022-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee Lee ,  Hangyu Hwang ,  Junghyun Im

IPC: H05K5/00 ,  G06F1/16 ,  H01Q1/24 ,  H04M1/02 ,  H05K5/02

CPC classification number: H05K5/0243 ,  G06F1/1656 ,  H01Q1/243 ,  H04M1/0283

Abstract: Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing. The electronic device includes a housing forming an exterior of the electronic device. The housing is constituted to include a non-conductive part including a non-conductive protrusion protruded from at least some area of the non-conductive part, a conductive deposition layer disposed on a top surface of the non-conductive part except on the non-conductive protrusion, and a decoration layer formed on the top of the conductive deposition layer. Accordingly, the housing is lightweight and can perform a function of an antenna radiator. Other various embodiments are possible.

公开(公告)号：US12301742B2

公开(公告)日：2025-05-13

申请号：US18120021

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghyun Im ,  Joungki Park ,  Jinwoo Park ,  Seungchang Baek ,  Yoonhee Lee ,  Jungwoo Choi ,  Sungho Cho ,  Hangyu Hwang ,  Jongchul Choi

IPC: H04M1/00 ,  H04M1/02

Abstract: An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

公开(公告)号：US12238878B2

公开(公告)日：2025-02-25

申请号：US17894543

申请日：2022-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungchang Baek ,  Hyeongsam Son ,  Changhyeok Shin ,  Yoonhee Lee ,  Junghyun Im ,  Sungho Cho ,  Jungwoo Choi ,  Hangyu Hwang ,  Minwoo Yoo

IPC: H01Q1/24 ,  H05K5/02

Abstract: An electronic device is provided. The electronic device includes a display, a frame structure including a first conductive member defining an external appearance of the electronic device and operated as an antenna element of the electronic device, a second conductive member coupled and electrically connected to the first conductive member, and a nonconductive member that supports the display together with the second conductive member, a bonding layer including a first layer at least partially disposed between the first conductive member and the nonconductive member, and a second layer at least partially disposed between the second conductive member and the nonconductive member, and at least one conductive connection member disposed at a portion, at which the first conductive member and the second conductive member are coupled to each other, and contacting the first conductive member and the second conductive member.

公开(公告)号：US10972591B2

公开(公告)日：2021-04-06

申请号：US16696418

申请日：2019-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghyun Im ,  Seungchang Baek ,  Sooncheol Kwon ,  Sungho Cho ,  Changyoun Hwang ,  Minwoo Yoo

IPC: H04M1/02 ,  H05K5/02 ,  H05K5/03 ,  H05K5/00

Abstract: Provided is an electronic device comprising a front cover; a rear cover facing in a direction opposite to that of the front cover; and a side frame enclosing a space between the front cover and the rear cover, a side frame at least partially forming an external shape of the electronic device, the side frame comprising conductive material; a support at least partially extended from the side frame to the space, the support comprising conductive material; and a polymer member coupled to at least a portion of the support or the side frame, wherein the polymer member comprises a first area in which an adhesive member for attachment of the front cover or the rear cover is disposed and a second area extended from the first area and contacting the side frame.