公开(公告)号：US20230029163A1

公开(公告)日：2023-01-26

申请号：US17714494

申请日：2022-04-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjoo KIM ,  Jungha KIM ,  Jinhyung TAK

IPC: G06N3/08

Abstract: A method of analyzing a wafer map using a neural network and a wafer map analysis system are provided. The method of analyzing a wafer map using a neural network includes creating a wafer map based on raw data, receiving, by an inception module including a plurality of inception layers, a first output feature map created based on the wafer map, outputting, by the inception module, a final inception output feature map based on the first output feature map, connecting the first output feature map to the final inception output feature map through a shortcut connection, and performing an addition operation on the first output feature map and the final inception output feature map to output a second output feature map.