公开(公告)号：US20140104795A1

公开(公告)日：2014-04-17

申请号：US14035089

申请日：2013-09-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Cheon WEE ,  Sung-Ill KANG ,  Jun-Woo PARK ,  Chang-Seok BAE

IPC: H05K7/14

CPC classification number: H05K7/14 ,  G06F1/1656 ,  G06F1/183 ,  H01R13/52 ,  H05K5/0247

Abstract: An electronic device is provided. The electronic device includes a mainboard, a housing, and a sealing member. The mainboard surface-mounts a socket connector thereon. The housing receives the mainboard and forms a through hole. The sealing member defines a space for receiving the socket connector via coupling with the mainboard and allows the space and the through hole of the housing to communicate with each other.

Abstract translation: 提供电子设备。 电子设备包括主板，壳体和密封构件。 主板在其上表面安装一个插座连接器。 外壳接收主板并形成通孔。 密封构件通过与主板联接而限定用于接收插座连接器的空间，并允许壳体的空间和通孔彼此连通。