公开(公告)号：US20170150657A1

公开(公告)日：2017-05-25

申请号：US15271620

申请日：2016-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Min SEO ,  Jun-Taek OH ,  Jin-Woo KIM ,  So-Young LEE

IPC: H05K9/00 ,  H05K1/14 ,  H05K1/02 ,  H05K7/14 ,  H05K1/18

CPC classification number: H05K9/0026 ,  H05K1/028 ,  H05K1/14 ,  H05K1/181 ,  H05K7/1427 ,  H05K9/0032 ,  H05K2201/10522

Abstract: A shield structure including a metallic plate that is disposed between the first electronic component and the second electronic component; a first side wall that encloses at least a portion of the first electronic component, and includes a first portion that is formed by a portion that extends from the peripheral edge of the metallic plate and is formed by being bent in the first direction; and a second side wall that encloses at least a portion the second electronic component, and includes a second portion that is formed by a portion that extends from the peripheral edge of the metallic plate and is formed by being bent in the second direction.