公开(公告)号：US20250167153A1

公开(公告)日：2025-05-22

申请号：US18932984

申请日：2024-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Okseon Yoon ,  Jinyoung Kim ,  Jiyoung Yoon ,  Kiseok Kim ,  Jihye Shim

IPC: H01L23/00 ,  G03F7/028

Abstract: A method of forming a redistribution pad, the method including forming a hole exposing a redistribution pattern in a redistribution insulating layer and forming a photoresist composition on a surface of the redistribution insulating layer and filling the hole. The photoresist composition including at least one first photoinitiator and at least one first crosslinking agent that cause a crosslinking reaction by a first light and at least one second photoinitiator and at least one second crosslinking agent that cause a crosslinking reaction by a second light having a different wavelength from the first light. The method further includes irradiating the first light to the photoresist composition, forming a photoresist pattern having a pattern hole using the photoresist composition to which the first light is irradiated, irradiating the second light to the photoresist pattern, and forming the redistribution pad using the photoresist pattern to which the second light is irradiated.