公开(公告)号：US20210347098A1

公开(公告)日：2021-11-11

申请号：US17283888

申请日：2019-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsu KIM ,  Sangsik NA ,  Rathore Pranveer SINGH ,  Youngjin Yl ,  Jongbae JEON ,  Donghyeon HWANG ,  Hangyu HWANG ,  Jinhyeong PARK ,  Youngik SON

IPC: B29C45/14 ,  H05K5/00 ,  H05K5/04

Abstract: A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.

公开(公告)号：US20250136792A1

公开(公告)日：2025-05-01

申请号：US19009378

申请日：2025-01-03

Applicant: Samsung Electronics Co., Ltd. ,  IL KWANG POLYMER. CO.,LTD

Inventor： Jinhyeong PARK ,  Eunkyung LEE ,  Hankyum LEE ,  Doorae KIM ,  Minhyouk KIM ,  Youngnam KIM ,  Youngoh KIM ,  Jonghwa KIM ,  Seongho PARK ,  Jeongseok PARK ,  Yeongjune SONG ,  Sanhui OH ,  Jaemin OK ,  Houk LEE ,  Byonghee CHO

IPC: C08K11/00

Abstract: A plastic composite material comprising coffee grounds is provided. The plastic composite material includes coffee grounds, wherein the particle size distribution of the coffee grounds has a particle size distribution of 94% by weight or more for coffee ground particles having a particle size greater than 250 μm and less than or equal to 850 μm, and wherein the plastic composite material has a colorimeter value of 4.4 or less.