公开(公告)号：US20240387590A1

公开(公告)日：2024-11-21

申请号：US18515334

申请日：2023-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinpyo Kim ,  Byungjun Park ,  Jimin Jeun ,  Hakyu Choi

IPC: H01L27/146

Abstract: An image sensor includes a substrate structure including a sensor array region and a pad region adjacent to the sensor array region. The substrate structure includes a first substrate structure and a second substrate structure. The first substrate structure is on the second substrate structure. The image sensor includes a penetrating structure including a first conductive material layer and a second conductive material layer in at least a portion of the first substrate structure. The second conductive material layer is electrically connected to the first conductive material layer and extends into the first substrate structure.