公开(公告)号：US09177887B2

公开(公告)日：2015-11-03

申请号：US14068091

申请日：2013-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Na Choi ,  Ji-Chul Kim ,  Se-Ran Bae ,  Eun-Seok Cho ,  Hee-Jung Hwang

IPC: H01L23/48 ,  H01L23/34 ,  G01R31/28 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L23/345 ,  G01R31/2875 ,  H01L22/34 ,  H01L23/34 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.

Abstract translation: 可以提供半导体测试装置及其制造方法。 半导体测试装置可以包括第一热测试倒装芯片单元，其包括第一加热器和第一传感器，以及形成在第一热测试倒装芯片单元下的测试基板。 第一热测试倒装芯片单元可以包括布置在第一热测试倒装芯片单元的底表面上的多个第一凸块，并且被配置为电连接到第一加热器和第一传感器。 测试基板可以包括在第一方向上布置在测试基板的底表面上的第一球阵列，并且被配置为电连接到电连接到第一加热器和第一传感器的多个第一凸块。

公开(公告)号：US08872337B2

公开(公告)日：2014-10-28

申请号：US14106912

申请日：2013-12-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Deuk Kim ,  Ji-Chul Kim

IPC: H01L27/00 ,  H01L23/36

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49894 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A semiconductor package includes a flexible base film having a first surface opposing a second surface, a semiconductor chip mounted on the first surface of the base film, and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip. The at least one conductive pattern is disposed through the base film and has a surface exposed at the second surface of the base film. A contact condition of the semiconductor package is determined based on detection of a conductive path between the at least one conductive pattern and a conductive frame or support surface of the semiconductor package. The contact condition provides an indication of heat dissipation that may be expected to occur for the chip during operation.

Abstract translation: 半导体封装包括具有与第二表面相对的第一表面的柔性基膜，安装在基膜的第一表面上的半导体芯片，以及包括与半导体芯片相邻的至少一个导电图案的触摸感测结构。 所述至少一个导电图案设置穿过所述基底膜并具有在所述基底膜的第二表面处露出的表面。 基于对至少一个导电图案和半导体封装的导电框架或支撑表面之间的导电路径的检测来确定半导体封装的接触状态。 接触条件提供可能预期在操作期间芯片发生的散热的指示。

公开(公告)号：US20140264339A1

公开(公告)日：2014-09-18

申请号：US14132790

申请日：2013-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Chul Kim ,  Hee-Jung Hwang ,  Seong-Ho Shin

IPC: F25B21/02 ,  H01L23/38 ,  H01L23/34

CPC classification number: F25B21/02 ,  F25B2321/0212 ,  H01L23/34 ,  H01L23/36 ,  H01L23/38 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In a heat slug and a semiconductor package including the same, the heat slug includes a thermal conductive body having an active face and a dissipating face opposite to the active face, a dielectric layer covering the active face of the body, at least one thermoelectric element arranged on the dielectric layer and a conductive pattern arranged on the dielectric layer and electrically connected to the thermoelectric element. The electrical characteristics of the thermoelectric element are interacted with heat generated from a heat source.

Abstract translation: 在散热片和包括其的半导体封装件中，散热片包括导热体，其具有活性面和与有源面相反的散开面，覆盖主体的有源面的电介质层，至少一个热电元件 布置在电介质层上，并且布置在电介质层上并与电热元件电连接的导电图案。 热电元件的电气特性与从热源产生的热量相互作用。