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公开(公告)号:US09882327B2
公开(公告)日:2018-01-30
申请号:US15404707
申请日:2017-01-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seok-Jae Han , Jeongsik Yoo , So-Young Jung
IPC: H01R31/06 , H01R12/72 , H04B1/3816 , H01R27/02 , G06K19/077 , H01R27/00
CPC classification number: H01R31/06 , G06K19/07737 , G06K19/07739 , H01R12/721 , H01R27/00 , H01R27/02 , H04B1/3816 , H05K5/0247
Abstract: A memory card adapter includes a body having a set of contact pins. The set of contact pins include input pins and output pins implemented in a pin-to-pin structure. The input pins connect with pins of an inserted memory card and the output pins connect with an external socket. The body includes a bottom lead adapted to support the main body, and a top lead adapted to be combined with the bottom lead. The body includes a fixing substance adapted to combine with the contact pins. The body includes a conduction plate on a top surface or a bottom surface of the fixing substance, where the conduction plate is connected to at least one of the contact pins.
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公开(公告)号:US20170125959A1
公开(公告)日:2017-05-04
申请号:US15404707
申请日:2017-01-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seok-Jae HAN , Jeongsik Yoo , So-Young Jung
CPC classification number: H01R31/06 , G06K19/07737 , G06K19/07739 , H01R12/721 , H01R27/00 , H01R27/02 , H04B1/3816 , H05K5/0247
Abstract: A memory card adapter includes a body having a set of contact pins. The set of contact pins include input pins and output pins implemented in a pin-to-pin structure. The input pins connect with pins of an inserted memory card and the output pins connect with an external socket. The body includes a bottom lead adapted to support the main body, and a top lead adapted to be combined with the bottom lead. The body includes a fixing substance adapted to combine with the contact pins. The body includes a conduction plate on a top surface or a bottom surface of the fixing substance, where the conduction plate is connected to at least one of the contact pins.
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