公开(公告)号：US11996270B2

公开(公告)日：2024-05-28

申请号：US17401443

申请日：2021-08-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunhee Jeang ,  Seongkeun Cho ,  Kyungrim Kim ,  Incheol Song ,  Jangwon Cho

IPC: H01J37/32 ,  C23C16/44 ,  C23C16/455 ,  C23C16/511 ,  H01L21/67

CPC classification number: H01J37/32238 ,  H01J37/32229 ,  H01J37/32669 ,  C23C16/4404 ,  C23C16/45565 ,  C23C16/511 ,  H01J37/3244 ,  H01J37/3266 ,  H01L21/67069

Abstract: A wafer processing apparatus includes a chamber body including a cavity region and a process region; a microwave waveguide configured to introduce a microwave into the cavity region; a first microwave window between the cavity region and the process region; and a magnetic field supplying device configured to apply a magnetic field inside the chamber body, wherein a thickness of the first microwave window is constant, and the first microwave window is configured to control a beam cross-section of the microwave in the process region.

公开(公告)号：US20220216039A1

公开(公告)日：2022-07-07

申请号：US17401443

申请日：2021-08-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunhee Jeang ,  Seongkeun Cho ,  Kyungrim Kim ,  Incheol Song ,  Jangwon Cho

IPC: H01J37/32

Abstract: A wafer processing apparatus includes a chamber body including a cavity region and a process region; a microwave waveguide configured to introduce a microwave into the cavity region; a first microwave window between the cavity region and the process region; and a magnetic field supplying device configured to apply a magnetic field inside the chamber body, wherein a thickness of the first microwave window is constant, and the first microwave window is configured to control a beam cross-section of the microwave in the process region.