公开(公告)号：US20230183881A1

公开(公告)日：2023-06-15

申请号：US17974239

申请日：2022-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaewon CHOI ,  Jaesik CHUNG

IPC: C25D17/00

CPC classification number: C25D17/004 ,  C25D17/001 ,  C25D17/007

Abstract: A plating apparatus may include a body, a lip seal structure connected to the body, and a conductive liquid. The body may include a cathode. The lip seal structure may be configured to hold a wafer. The lip seal structure may include a bottom portion, a contact portion connected to the bottom portion and contacting the wafer, and at least one partition structure protruding from an upper surface of the bottom portion. The conductive liquid may cover the upper surface of the bottom portion and may be configured to electrically connect the cathode and the wafer.