公开(公告)号：US12047524B2

公开(公告)日：2024-07-23

申请号：US17554100

申请日：2021-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suyang Park ,  Myeongkoo Kang ,  Minjae Kim ,  Jaehyeok Shin ,  Sungmin Lee

IPC: H04M1/02

CPC classification number: H04M1/0277 ,  H04M1/0249 ,  H04M1/0264 ,  H04M1/0266

Abstract: According to various embodiments of the disclosure, an electronic device may comprise a housing including a conductive portion, a wireless communication circuit electrically connected with the conductive portion, a first camera module disposed in a first area of the housing proximate to the conductive portion and including a first camera assembly and a flexible circuit board extending from the first camera assembly, a second camera module disposed in a second area of the housing, spaced apart from the first camera module, and including a second camera assembly and a camera bracket covering the second camera assembly and forming at least a partial surface of the housing, and a conductive pattern having at least a portion disposed between the first area and the second area and including a first portion coupled with the first camera module and a second portion coupled with the camera bracket. Other various embodiments are possible.