公开(公告)号：US20210143116A1

公开(公告)日：2021-05-13

申请号：US17007223

申请日：2020-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： JISEOK HONG ,  HYUEKJAE LEE ,  JONGPA HONG ,  JIHWAN HWANG ,  TAEHUN KIM

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/48

Abstract: A semiconductor package includes a first semiconductor chip having a through-electrode and an upper connection pad on an upper surface of the first semiconductor chip that is connected to the through-electrode; a second semiconductor chip stacked on the first semiconductor chip, and having a lower connection pad on a lower surface of the second semiconductor chip; a non-conductive film between the first semiconductor chip and the second semiconductor chip, with the non-conductive film including voids having an average diameter of 1 μm to 100 μm, the voids having a volume fraction of 0.1 to 5 vol %; and a connection conductor that penetrates the non-conductive film and connects the upper connection pad and the lower connection pad.

公开(公告)号：US20220068863A1

公开(公告)日：2022-03-03

申请号：US17500079

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： JISEOK HONG ,  HYUEKJAE LEE ,  JONGPA HONG ,  JIHWAN HWANG ,  TAEHUN KIM

IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip having a through-electrode and an upper connection pad on an upper surface of the first semiconductor chip that is connected to the through-electrode; a second semiconductor chip stacked on the first semiconductor chip, and having a lower connection pad on a lower surface of the second semiconductor chip; a non- conductive film between the first semiconductor chip and the second semiconductor chip, with the non-conductive film including voids having an average diameter of 1μm to 100 um, the voids having a volume fraction of 0.1 to 5 vol %; and a connection conductor that penetrates the non- conductive film and connects the upper connection pad and the lower connection pad.