公开(公告)号：US20220132701A1

公开(公告)日：2022-04-28

申请号：US17342995

申请日：2021-06-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungki LEE ,  Jiyong KIM ,  Insub KWAK ,  Suin KIM ,  Chunghyun RYU

IPC: H05K7/20 ,  H05K5/02 ,  H05K1/02 ,  G06F1/18

Abstract: A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber.