公开(公告)号：US12294140B2

公开(公告)日：2025-05-06

申请号：US18141146

申请日：2023-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongwan Park ,  Gyubok Park ,  Min Sakong ,  Moonsoo Son ,  Kwanseok Lee ,  Injin Hwang

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q5/30

Abstract: An electronic device according to an embodiment may include an antenna radiator, a conductive member, a wireless communication circuit configured to feed power to a first point of the conductive member and a second point spaced apart from the first point, and a ground electrically connected to a third point between the first point and the second point of the conductive member, at least a portion of one region of the conductive member including the third point may overlap the antenna radiator, and the wireless communication circuit may be configured to transmit and/or receive a signal of a first frequency band based on a first electrical path formed by feeding power to the first point of the conductive member; and transmit and/or receive the signal of the first frequency band based on a second electrical path formed by feeding power to the second point of the conductive member.