公开(公告)号：US11388841B2

公开(公告)日：2022-07-12

申请号：US17266355

申请日：2019-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunmin Oh ,  Sungjin Park ,  Daegyu Kang ,  Insu Kim ,  Daegi Lee ,  Jonghyun Lee

IPC: H05K7/20 ,  H04R1/02 ,  H04R9/02

Abstract: An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.

公开(公告)号：US10609480B2

公开(公告)日：2020-03-31

申请号：US16182743

申请日：2018-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daegi Lee ,  Daegyu Kang ,  Seokhyun Mun ,  Yongwook Park ,  Hyunmin Oh

IPC: H04R3/00 ,  G10L25/51 ,  H04R1/40 ,  G06F3/16 ,  G10L15/00

Abstract: Certain embodiments of the present disclosure are related to an apparatus and a method for executing a function corresponding to pattern data generated using a plurality of microphones. An electronic device may include a plurality of microphones and a processor. The processor may be configured to detect a user input at the plurality of the microphones, to generate pattern data based on the user input, and to execute a function corresponding to the pattern data.

公开(公告)号：US10681439B2

公开(公告)日：2020-06-09

申请号：US16535569

申请日：2019-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwoo Kim ,  Sujin Jung ,  Youngjin Cho ,  Sungjin Park ,  Hyunmin Oh ,  Iksu Jung

IPC: H04R1/02 ,  H05K7/20 ,  H04R1/04 ,  H04R3/12 ,  H04R1/24 ,  H04R1/40

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate and at least one first opening; and a speaker structure spaced apart from the first plate and disposed in the housing, wherein the speaker structure includes a first structure which faces in a first direction, opposes the first plate, and forms a space connecting to the at least one first opening along with the first plate; a second opening formed by penetrating through a part of the first structure; at least one component disposed in the speaker structure and emitting heat; a thermal conducting member including a first portion disposed in the speaker structure and being in contact with the at least one component, and a second portion disposed in the second opening; and at least one speaker disposed in a direction different from the first direction.