TEST APPARATUSES FOR SEMICONDUCTOR DEVICES

    公开(公告)号:US20220146571A1

    公开(公告)日:2022-05-12

    申请号:US17517057

    申请日:2021-11-02

    Abstract: A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

    TEST BOARD AND TEST DEVICE INCLUDING THE SAME

    公开(公告)号:US20230408576A1

    公开(公告)日:2023-12-21

    申请号:US18303845

    申请日:2023-04-20

    CPC classification number: G01R31/2863 G01R1/0466

    Abstract: A test board is provided. The test board comprises a first region which includes a first upper surface with first test sockets aligned thereon, and a first lower surface opposite to the first upper surface, a second region which includes a second upper surface with second test sockets aligned thereon, and a second lower surface opposite to the second upper surface, a hinge portion between the first region and the second region, and configured to connect the first region and the second region such that the first region and the second region are folded or unfolded, a first connector at one end of the first region opposite to the hinge portion and a second connector at one end of the second region opposite to the hinge portion.

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