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公开(公告)号：US10971662B2
公开(公告)日：2021-04-06
申请号：US15145972
申请日：2016-05-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyuk-jin Cho , Dong-hoon Lee
Abstract: A light-emitting diode (LED) package includes a light-emitting structure, a transmissive material layer on the light-emitting structure, and a support structure covering at least a portion of a side surface of the transmissive material layer, a side surface of the light-emitting structure, and at least a portion of a bottom surface of the light-emitting structure.
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